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Through-hole devices mounted on the circuit board of a mid-1980s home computer. Axial-lead devices are at upper left, while blue radial-lead capacitors are at upper right

Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, but are still used for making interconnections between the layers and in this role are more usually called vias.

Close-up view of an electronic circuit board showing component lead holes (gold-plated) with through-hole plating up the sides of the hole to connect tracks on both sides of the board. The holes are circa 1mm diameter.

Through-Hole Assembly

Through-hole PCB assembly technology refers to the mounting scheme used for electronic components that involve the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by the manual assembly (hand placement) or by the use of automated insertion mount machines.

The quality of the solder joint is important for several reasons. The solder joint is the actual connection between the component and the board. The quality of the solder joint is equivalent to the quality of the connection. The “look” of the solder joint is less important but is usually indicative of the quality of the solder joint.

Steps in soldering a thru-hole component:

Figures 1-1 through 1-4 display the general steps in soldering a thru-hole component. In step 1, the hole and pad to be soldered are prepared, with the lead being placed into/through the hole. The lead should be placed in such a way as to keep the bend above the soldered area, reducing heat and solder requirements.

In step 2, heat is applied evenly to the heat and the pad/ hole, heating the material so the solder will adhere to both surfaces.

STEP 3: The solder contacts the end of the iron, which causes the solder to change into a liquid and flow into the hole

STEP 4: The solder flows through the hole, creating a mound on both the bottom and topside. Since this lead was soldered from the topside, the bottom side should be inspected for adequate solder and joint quality. Some assembly may require solder from both sides to ensure quality. Adequate clearance inside the hole allows good solder flow through the board, allowing only one side to have solder applied. Tight clearances may require soldering on both sides, increasing soldering time.